Advanced package Design (APD)

APPLY Tata Consultancy Services

Skill – Advanced package Design (APD) Location- Bangalore Experience – 5years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of Cadence Allegro tools – Allegro Package Design/ Allegro SIP, or equivalent Experience of Synopsys 3D IC compiler and ICC2 is added advantage Desi…

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